R&D Applications Engineer, Emulex Connectivity Division (ECD)

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Job Description: Applications Engineer Broadcom’s Emulex Connectivity Division (ECD) is seeking a talented and passionate engineer to join the R&D Applications Engineering (AE) team. Our global organization provides the Fibre Channel HBAs for data center and enterprise customer’s SAN connectivity. As an AE, you will work directly with top-tier OEMs and internal design teams to launch and maintain cutting-edge storage networking products.  You will be the bridge between customer design and support teams and our internal development teams, resolving complex technical issues in the enterprise storage landscape. Responsibilities Include Triage, Debug & Root Cause Analysis: Analyze and resolve complex issues found within Emulex Fibre Channel HBAs.  Collaborate with firmware, driver, hardware, and test teams to provide timely solutions. Protocol & Log Analysis: Review Firmware, Driver, and OS logs. Capture and analyze Fibre Channel (FC) protocol bus traces to assist in the triage and identification of the root causes of system-level failures. Technical Documentation: Develop high-quality product documentation, white papers, and application notes to assist customers in implementing Emulex features. Other Responsibilities Release Management: Coordinate software/firmware release timing with development teams and assist in the production of comprehensive Release Notes. Travel: Occasional travel, some of which may be international, to support customer sites or industry events. Requirements/Qualifications Technical Expertise: Proven experience with system level, host software (drivers/BIOS), networking, and hardware-level debugging. Protocol Knowledge: Prior experience in embedded software, driver development, or debug of networking (e.g. Ethernet) and/or storage networking technologies (e.g. Fibre Channel). Hardware Proficiency: Ability to read and interpret board schematics. Soft Skills: Exceptional written and verbal communication skills; must be able to articulate complex technical problems to both customers and internal executives. Education: Bachelor of Science in Electrical Engineering, Computer Engineering, or a related field with 8+ years of relevant experience (or a Master’s Degree with 6+ years of experience). Desirable Skills Experience with Fibre Channel (SCSI/FCP), NVMe over Fabrics (NVMe-oF), iSCSI, or RoCE. Familiarity with protocol analyzers (e.g., Teledyne LeCroy, Viavi) Experience with ARM-based embedded processors and SoC architectures. Presentation skills for representing Broadcom at industry plug-fests or technology forums. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $108,000 - $172,800  This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.